CAS RN: 7803-51-2
UN/NA: 2199

Cleanup Methods

ACCIDENTAL RELEASE MEASURES: Personal precautions, protective equipment and emergency procedures: Wear respiratory protection. Avoid breathing vapors, mist or gas. Ensure adequate ventilation. Remove all sources of ignition. Evacuate personnel to safe areas. Beware of vapors accumulating to form explosive concentrations. Vapors can accumulate in low areas. Environmental precautions: Prevent further leakage or spillage if safe to do so. Do not let product enter drains. Discharge into the environment must be avoided. Methods and materials for containment and cleaning up: Clean up promptly by sweeping or vacuum.
Arsine and phosphine were removed from waste gases of semiconductor manufacture by ozone oxidation and carbon adsorption.
Porous supports (pearlite or aluminum oxide) impregnated with aqueous silver nitrate, or with aqueous ferric chloride containing other metal salts are used for purging of phosphine in waste gas from a semiconductor plant.
Poisonous gases, including phosphine, are diluted with nitrogen or neon and injected into an aqueous foaming agent, preferably under paraffin.
Wear special protective clothing and positive pressure self-contained breathing apparatus. ... Stop or control the leak, if this can be done without undue risk. Use water spray to cool and disperse vapors and protect personnel. Approach release from upwind.
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